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Fulvio Mancarella received a M. Sc. degree in Electrical Engineering and a Ph. D. degree in Electronics and Computer Science in 2002 and 2006, respectively, both from Bologna University.
Since 2009 he joined the Institute of Microelectronics and Microsystems (IMM) of the Italian National Research Council (CNR) as a scientific researcher.
His research interests include technology development for the fabrication of micro-electro-mechanical systems (MEMS).
Since 2003 he has been working on the development of infrared thermoelectric transducers for the 3-5 µm atmospheric window fabricated with CMOS-compatible micromachining techniques in the framework of the EU project “NETGAS” (ST-2001-37802-FP5), aiming at the realization of a photoacoustic gas sensing microsystem based on heavly-dopped polysilicon.
Since January 2006, the activities for the development of sensors based on silicon microsystem has been working in the framework of the regional project (LaRIA). The activities have been focused on the development of deep silicon etching by Deep Reactive Ion Etching (D-RIE).
In the same period, he has been working on the fabrication of MEMS resonant strain sensors for structural monitoring applications in the framework of the EUROCORES "Micro-measurement and Monitoring System for Ageing Underground Infrastructures - Underground M3" project funded within S3T Programme (FP6), coordinated by the University of Cambridge.
Since 2007, he has been mainly working in several industrial research project funded by private companies, in the field of technology development for inkjet applications, separation system for micro gas chromatography and a feasibility study aiming at the realization of micro nozzles for biochemical application.
In 2010 he has been working in a feasibility study, funded by private company and in collaboration with Università degli Studi di Milano-Bicocca, aiming at the develop of silicon-based nanostructured thermoelectric devices for power harvesting application.
Since 2012 he has been working on the development of silicon photonics devices for DataCom application in the framework of FIRB project “MINOS” (Dispositivi fotonici micro- e nano-strutturati basati su silicio deformato per commutazione ultra-rapida in applicazioni datacom).
In the same period, he has been working of the fabrication of power microgeneration and storage devices, in the framework of European Project (FP7-NMP-2013-SMALL-7) ”SiNERGY” (Silicon friendly materials and device solutions for microenergy applications).
SKYPE ID: fulvio.mancarella
Scientific Productions
Mechanism Governing Surface Roughening of Al Ion Implanted 4H-SiC during Annealing under a C-Cap
Materials Science Forum [Trans Tech Publications Ltd], Volume: 1062 Pages: 235-240
2019 PhotonIcs & Electromagnetics Research Symposium-Spring (PIERS-Spring) [IEEE], Pages: 223-228
Micro-Opto-Mechanical sensors for tactile width measurements of surface opening cracks in concrete
2017 IEEE SENSORS [IEEE], Pages: 1-3
Induced strain in silicon waveguides and couplers
Silicon Photonics X [International Society for Optics and Photonics], Volume: 9367 Pages: 93671L
Ion Implanted Lateral p+-i-n+ Diodes on HPSI 4H-SiC
Materials Science Forum [Trans Tech Publications Ltd], Volume: 821 Pages: 620-623
Study of induced strain in silicon rib structures
11th International Conference on Group IV Photonics (GFP) [IEEE], Pages: 195-196
2014 20th International Conference on Ion Implantation Technology (IIT) [IEEE], Pages: 1-4
Challenges and progress toward a silicon-based multi-microring optical network-on-chip
2014 European Conference on Networks and Communications (EuCNC) [IEEE], Pages: 1-5
Lattice deformations in strained-silicon rib structures for photonic devices
2014 Fotonica AEIT Italian Conference on Photonics Technologies [IEEE], Pages: 1-3
45th International Symposium of Essential Oils (ISEO 2014) [], Volume: 1 Pages: 37-37
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII) [IEEE], Pages: 992-995
High quality surface micromachining of LiNbO3 by ion implantation-assisted etching
Micromachining and Microfabrication Process Technology XVIII [International Society for Optics and Photonics], Volume: 8612 Pages: 86120E
High dose Al+ implanted and microwave annealed 4H-SiC
Materials Science Forum [Trans Tech Publications Ltd], Volume: 717 Pages: 817-820
Epitaxial Growth, Mechanical, Electrical Properties of SiC/Si and SiC/Poli-Si
Materials Science Forum [Trans Tech Publications Ltd], Volume: 717 Pages: 897-900
Fabrication and testing of a high resolution extensometer based on resonant MEMS strain sensors
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference [IEEE], Pages: 1056-1059
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference [IEEE], Pages: 594-597
Carbon-Cap for Ohmic Contacts on n-Type Ion Implanted 4H-SiC
Materials Science Forum [Trans Tech Publications Ltd], Volume: 679 Pages: 504-507
β-SiC NWs grown on patterned and MEMS silicon substrates
Materials Science Forum [Trans Tech Publications Ltd], Volume: 679 Pages: 508-511
Design and prototyping of a MEMS-based crackmeter for structural monitoring
TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and Microsystems Conference [IEEE], Pages: 315-318
SENSORS, 2008 IEEE [IEEE], Pages: 1131-1134
2008 15th IEEE International Conference on Electronics, Circuits and Systems [IEEE], Pages: 89-92
TRANSDUCERS 2007-2007 International Solid-State Sensors, Actuators and Microsystems Conference [IEEE], Pages: 615-618
TRANSDUCERS 2007-2007 International Solid-State Sensors, Actuators and Microsystems Conference [IEEE], Pages: 1661-1664
Wafer-level measurement of thermal conductivity on thin films
SENSORS, 2006 IEEE [IEEE], Pages: 1239-1242
SENSORS, 2006 IEEE [IEEE], Pages: 1235-1238
Wafer-level testing of thermopile IR detectors
SENSORS, 2005 IEEE [IEEE], Pages: 4 pp.
Fabrication of Pt-polysilicon thin-film thermopiles: A preliminary study
SENSORS, 2005 IEEE [IEEE], Pages: 1141-1144
Growth of thick [111]-oriented 3C-SiC films on T-shaped Si micropillars
Materials & Design [Elsevier], Pages: 109833
Design and Characterization of a Silicon W-Band Woodpile Photonic Crystal Waveguide
IEEE Microwave and Wireless Components Letters [IEEE], Volume: 30 Issue: 4 Pages: 347-350
Nanostrain Resolution Strain Sensing by Monocrystalline 3C-SiC on SOI Electrostatic MEMS Resonators
Journal of Microelectromechanical Systems [IEEE], Volume: 29 Issue: 1 Pages: 117-128
3C-SiC Growth on Inverted Silicon Pyramids Patterned Substrate
Materials [Multidisciplinary Digital Publishing Institute], Volume: 12 Issue: 20 Pages: 3407
Journal of Crystal Growth [North-Holland],
Materials Science Forum [], Volume: 924 Pages: 913
Integration of InGaP/GaAs/Ge triple‐junction solar cells on deeply patterned silicon substrates
Progress in Photovoltaics: Research and Applications [], Volume: 24 Issue: 10 Pages: 1368-1377
Journal of Micromechanics and Microengineering [IOP Publishing], Volume: 26 Issue: 9 Pages: 095018
Processing-Induced Electrically Active Defects in Black Silicon Nanowire Devices
ACS applied materials & interfaces [American Chemical Society], Volume: 8 Issue: 16 Pages: 10443-10450
Chemosphere [Pergamon], Volume: 149 Pages: 211-218
Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators
Sensors and Actuators A: Physical [Elsevier], Volume: 239 Pages: 90-101
Influence of grain size on the thermoelectric properties of polycrystalline silicon nanowires
Journal of Electronic Materials [Springer US], Volume: 44 Issue: 1 Pages: 371-376
ECS Transactions [The Electrochemical Society], Volume: 64 Issue: 6 Pages: 631-648
Fabrication of fiber-optic broadband ultrasound emitters by micro-opto-mechanical technology
Journal of Micromechanics and Microengineering [IOP Publishing], Volume: 24 Issue: 8 Pages: 085003
Biomedical microdevices [Springer US], Volume: 16 Issue: 3 Pages: 415-426
Macromolecular rapid communications [], Volume: 35 Issue: 3 Pages: 355-359
Strain relaxation of GaAs/Ge crystals on patterned Si substrates
Applied Physics Letters [], Volume: 104 Issue: 2
Strain relaxation of GaAs/Ge crystals on patterned Si substrates
Applied Physics Letters [American Institute of Physics], Volume: 104 Issue: 2 Pages: 022112
Identification and tackling of a parasitic surface compound in SiC and Si-rich carbide films
Materials Science and Engineering: B [Elsevier], Volume: 178 Issue: 9 Pages: 623-629
Phonon scattering enhancement in silicon nanolayers
Journal of materials science [Springer US], Volume: 48 Issue: 7 Pages: 2779-2784
High quality surface micromachining of LiNbO3 by ion implantation-assisted etching
Proc. of SPIE Vol [], Volume: 8612 Pages: 86120E-1
A Novel Pneumatically Driven SU-8 Microvalve for High Speed Gas Chromatographic Applications
Proceedings NSTI-Nanotech [], Pages: 172-175
Carbon-cap for ohmic contacts on ion-implanted 4H–SiC
Electrochemical and Solid State Letters [IOP Publishing], Volume: 13 Issue: 12 Pages: H432
Micromachined gas calibration sources based on nanometric depth microchannels
Procedia Engineering [Elsevier], Volume: 5 Pages: 1344-1347
Development of MEMS strain sensors for crack monitoring in ageing civil infrastructures
Smart Structures and Systems [], Volume: 6 Issue: 3 Pages: 225-238
Strain sensing on steel surfaces using vacuum packaged MEMS resonators
Procedia Engineering [Elsevier], Volume: 5 Pages: 1426-1429
Growth and characterization of 3C-SiC films for micro electro mechanical systems (MEMS) applications
Crystal growth & design [American Chemical Society], Volume: 9 Issue: 11 Pages: 4852-4859
Strain Evaluation in SiC MEMS Test Structures
ECS Transactions [IOP Publishing], Volume: 25 Issue: 8 Pages: 1031
Development of MEMS strain sensors for crack monitoring in ageing civil infrastructures
Smart Struct. Syst [], Volume: 6 Pages: 225-238
Sensors and Actuators B: Chemical [Elsevier], Volume: 141 Issue: 1 Pages: 322-328
Sensors and Actuators B: Chemical [Elsevier], Volume: 135 Issue: 1 Pages: 342-351
PROCESS DEPENDENCE OF DOPED POLYSILICON THERMAL CONDUCTIVITY FOR THERMAL MEMS
Proceedings of the 11th Italian Conference on Sensors and Microsystems, Lecce, Italy, 8-10 February 2006 [World Scientific], Pages: 267
CMOS-compatible fabrication of thermopiles with high sensitivity in the 3–5μm atmospheric window
Sensors and Actuators B: Chemical [Elsevier], Volume: 125 Issue: 1 Pages: 214-223
A measurement technique for thermoelectric power of CMOS layers at the wafer level
Sensors and Actuators A: Physical [Elsevier], Volume: 132 Issue: 1 Pages: 289-295
FOR DIELECTRIC MEMBRANES USINGTMAH'
Sensors And Microsystems-Proceedings Of The 9th Italian Conference [World Scientific], Pages: 373
Abstract book-International conference on quantum dots 2014 [],
Fabrication and Thermoelectric Characterization of Surface-Micromachined Silicon Nanowires
2012 E-MRS Spring Meeting-Book of Abstracts [FR],
A COMPUTATIONALLY EFFICIENT MODEL FOR THERMAL SENSORS SIMULATION
Sensors And Microsystems [], Pages: 152-156
WAFER-LEVEL MEASUREMENT OF THIN FILMS THERMOELECTRIC POWER
Sensors And Microsystems [], Pages: 578-583
PROCESS DEPENDENCE OF DOPED POLYSILICON THERMAL CONDUCTIVITY FOR THERMAL MEMS APPLICATIONS
Sensors And Microsystems [], Pages: 267-271
HIGHLY SENSITIVE THERMOELECTRIC TRANSDUCERS WITH CMOS MATERIALS
Sensors And Microsystems [], Pages: 573-577
AN OPTIMIZED FRONT-SIDE MICROMACHINING PROCESS FOR DIELECTRIC MEMBRANES USING TMAH
Sensors And Microsystems [], Pages: 374-378