This work has investigated the impact of crystallographic structure on SnAgCu (SAC) solder reliability at print board circuit (PCB) level. A detailed reliability analysis has been performed on packages with different solder thickness. The correlation between experiments and Finite Element Model results explains how NiAu metallization and the reduction of solder thickness improve the solder joint reliability performances.
5 Jul 2020
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)