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Type: 
Journal
Description: 
In below, reference 1 is incorrect. It should read: A. Sitta, M. Calabretta, M. Renna, and D. Cavallaro, “Solder joint reliability: Thermo-mechanical analysis on power flat packages” in Advances on Mechanics, Design Engineering and Manufacturing . Cham, Switzerland: Springer, 2017, pp. 709–716.
Publisher: 
IEEE
Publication date: 
18 Dec 2019
Authors: 

Giuseppe Mirone, Alessandro Sitta, Giuseppe D’Arrigo, Michele Calabretta

Biblio References: 
Volume: 19 Issue: 4 Pages: 796-796
Origin: 
IEEE Transactions on Device and Materials Reliability