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Memory stacks for charge trapping cells have been produced exploiting Al-doped HfO2, Al2O3, and SiO2 made by atomic layer deposition. The fabricated stacks show superior stability and electrical characteristics, allowing for the engineering of sub-1 nm equivalent oxide thickness Al doped HfO2 trapping layer with excellent retention characteristics, also at high temperature. The low Al doping content (4.5%) used in this work leads to the HfO2 crystallization, upon thermal annealing, in the cubic/tetragonal phase with a dielectric constant value of 32. The trapping properties of the proposed stacks have been studied by means of physics-based models, highlighting the role of the different layers and the nature of the traps contributing to the charge storage in the memory stack.
American Chemical Society
Publication date: 
30 Aug 2018

Sabina Spiga, Francesco Driussi, Gabriele Congedo, Claudia Wiemer, Alessio Lamperti, Elena Cianci

Biblio References: 
Volume: 1 Issue: 9 Pages: 4633-4641
ACS Applied Nano Materials