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Copper interconnects in modern integrated circuits require ultra-thin barriers to prevent intermixing of Cu with surrounding dielectric materials. Conventional barriers rely on metals like TaN, however their finite thickness reduces the cross-sectional area and significantly increases the resistivity of nanoscale interconnects. In this study, a new class of two-dimensional (2D) Cu diffusion barriers, hexagonal boron nitride (h-BN) and molybdenum disulfide (MoS2), is demonstrated for the first time. Using time-dependent dielectric breakdown measurements and scanning transmission electron microscopy coupled with energy dispersive X-ray spectroscopy and electron energy loss spectroscopy, these 2D materials are shown to be promising barrier solutions for ultra-scaled interconnect technology. The predicted lifetime of devices with directly deposited 2D barriers can achieve three orders of magnitude improvement compared to control devices without barriers.
Publication date: 
30 Jun 2017

Chun-Li Lo, Massimo Catalano, Kirby KH Smithe, Luhua Wang, Shengjiao Zhang, Eric Pop, Moon J Kim, Zhihong Chen

Biblio References: 
arXiv preprint arXiv:1706.10178